Samsung S7 Cannot Boot With 100mA Current Leakage

Samsung S7 Cannot Boot With 100mA Current Leakage

Defective Model: SAMSUNG S7

Released 2016, March 11

Version: G930FD (Global; Southeast Asia)

Phénomène de défaut

Drop damage caused the phone chips poor soldering or the PCB inner rail broken.

Troubleshooting And Repair

Connect the motherboard with DC power supply with 130mA current leakage.

Trigger to start up, the current can reach 200mA but cannot boot.

For issues with >100mA current leakage, normally there should be hot area.

We can touch and feel the hot area, then focus on this area to find out the suspicious defective chip or component. After carefully inspection, we find the PMIC PM8996 is hot.

Combine with the real drop situation, the damage trace is just around the PMIC.

So we just remove the PMIC and replace it with a new one

After chip replacement, install the phone and test, issue get resolved.

Cours de réparation de téléphone Android