Réparation de l'iPhone 12 Pro endommagé par une chute

A severely drop-damaged iPhone 12 Pro can seem beyond repair, especially when both the screen and back cover are shattered, the camera module is damaged, and worst of all, the motherboard is separated. However, for those who want to preserve their data, a motherboard chip swap is a viable solution. In this guide, we’ll walk you through the intricate repair process, ensuring the encrypted chips are transferred to a new donor motherboard successfully. Whether you’re a repair professional or a DIY enthusiast, follow along to learn the essential techniques required for motherboard-level iPhone repairs.

Damage Assessment

Upon receiving the iPhone 12 Pro, we identified the following issues:

• Cracked screen and glass back cover
• Damaged camera module
• Separated motherboard (severely deformed with missing pads on the middle layer)
• CPU, NAND chip, and Logic EEPROM appear intact

The customer’s primary concern is récupération des données, so a full motherboard replacement isn’t an option. Instead, we will swap the essential encrypted chips to a donor motherboard.

Step-by-Step Repair Process

Step 1: Motherboard Disassembly

• Carefully disassemble the iPhone and remove the motherboard.
• Since the motherboard is already separated due to the impact, we inspect all components to determine salvageable parts.

Processus de réparation

Step 2: Extracting the Encrypted Chips

To successfully retain the user’s data, we must transfer three key components:

• NAND chip (stores system and user data)
• CPU (central processing unit responsible for processing tasks)
• Logique EEPROM (important for device-specific configurations)

Remarque : Removing the Logic EEPROM requires caution, as this chip is small and prone to cracking. Handle it gently, avoid excessive force, and be mindful of airflow to prevent the chip from being dislodged.

Removing the NAND Chip and CPU

• Use a special knife and a pistolet à air chaud to remove the black glue securing the NAND chip.
• Gently lift the NAND chip and reball the pads to ensure clean and smooth connections.
• Repeat the process for the CPU, carefully removing residual glue before reballing.

Step 3: Soldering to the Donor Motherboard

• Align and solder the NAND chip, CPU, and Logic EEPROM onto the donor motherboard.
• Ensure each pad is clean and correctly positioned to avoid soldering errors.

Step 4: Testing the Boot Process

• Trigger the boot process using a signal board only to verify if the CPU and NAND chip are functioning correctly.
• A normal boot current confirms a successful chip transfer.

Step 5: Wi-Fi Module Transfer for Data Backup

Since the data backup will be performed via Wi-Fi, the original encrypted Wi-Fi module must also be swapped.

• Heat and remove the Wi-Fi module chip.
• Clean and reball the Wi-Fi module before soldering it onto the donor motherboard.

Step 6: Reassembling the Motherboard

• Utiliser un plate-forme de chauffage to recombine the two layers of the motherboard.

Step 7: Final Assembly and Data Backup

• Reassemble the iPhone and ensure all connections are secure.
• Power on the device and connect to Wi-Fi to begin the data backup process.

Outils et pièces nécessaires

• Pistolet à air chaud
• Special knife for glue removal
• Soldering station
• Reballing tools (stencil, solder balls, and flux)
• Plate-forme de chauffage
• Donor motherboard

Conclusion :

Successfully repairing a severely damaged iPhone 12 Pro while preserving data requires precision, expertise, and the right tools. By carefully transferring the encrypted NAND, CPU, and Logic EEPROM to a donor motherboard, the device can be restored, allowing the user to recover important data. If you’re looking to refine your repair skills further, visit Académie REWA for detailed training and advanced repair techniques.

Stay tuned for more iPhone repair insights and professional tips from REWA!