{"id":2133,"date":"2019-11-16T00:00:00","date_gmt":"2019-11-16T00:00:00","guid":{"rendered":"http:\/\/192.168.2.19:8666\/?p=1"},"modified":"2023-11-20T18:31:26","modified_gmt":"2023-11-20T10:31:26","slug":"essential-tools-for-double-stacked-motherboard","status":"publish","type":"post","link":"https:\/\/rewa.tech\/fr\/essential-tools-for-double-stacked-motherboard\/","title":{"rendered":"Outils essentiels pour la r\u00e9paration des cartes m\u00e8res \u00e0 double pile"},"content":{"rendered":"

iPhone series from\u00a0 iPhone X<\/a> to the newest iPhone 11 Pro Max comes with the double-stacked motherboard.<\/p>\n

Therefore, it is important for repair shops to improve double-stacked motherboard repair techniques. REWA highly recommends the following 3 must-have tools for iPhone double-stacked motherboard repair.<\/p>\n

Check it now! Double-stacked Motherboard Repair Steps There are 4 steps to repair the double-stacked motherboard as follows:<\/p>\n

\u00c9tape 1 : S\u00e9paration de la carte m\u00e8re<\/strong><\/h2>\n

When repairing the logic board of the iPhone series before iPhone X, we can remove\/solder components with the help of the Pistolet \u00e0 air chaud<\/a>.<\/p>\n

However, with the motherboards of iPhone X and later models being double-stacked, the Hot Air Gun fails to heat the third space PCB evenly due to the large range.<\/p>\n

Hereby we recommend this Specialized Heating platform for your double-stacked motherboard repair.<\/p>\n

A Must-have Tool For Motherboard Separating During Double-stacked Motherboard Repair – 3 in 1 Heating Platform For iPhone X\/XS\/XS Max<\/a><\/p>\n

You will need the Motherboard Disassemble Platform Main Unit For iPhone – SS-T12A and Motherboard Disassemble Platform Heating Groove For iPhone X\/XS\/XS Max – T12A – X3.<\/p>\n

The 3 in 1 Heating Platform For iPhone X\/XS\/XS Max is suitable for iPhone X\/XS\/XS Max motherboard separating, CPU and other components removing. The temperature range is 100-280\u2103.<\/p>\n

Conseils :<\/strong> Traditional Hot Air Gun features high requirements for temperature control.<\/p>\n

Therefore, any carelessness may result in solder joint falling-off or bridging that leads to not turning on of the motherboard or other issues.<\/p>\n

\"3<\/p>\n

Step 2: Diagnosing & Trouble Shooting<\/strong><\/h2>\n

During the repairing of the double-stacked motherboard, there is always a time when we need to test the motherboard completely.<\/p>\n

And to do that, we need to solder the two layers back together.<\/p>\n

Now, with this third space PCB Test Fixture, we can test the motherboard completely without recombining the two layers.<\/p>\n

A Must-have Tool For Diagnosing&Troubleshooting During Double-stacked Motherboard Repair – 2 in 1 Test Fixture For iPhone XS\/XS Max<\/a> et Test Fixture For iPhone X<\/a> With the help of the test fixture, repair technicians can narrow down fault possibilities when troubleshooting the motherboard.<\/p>\n

It can not only improve repair efficiency but also bring less damage to the motherboard.<\/p>\n

\"3<\/p>\n

Step 3: Lower Layer Reballing<\/strong><\/h2>\n

We need to solder the two layers back together after troubleshooting.<\/p>\n

A Must-have Tool For Lower Layer Reballing During Double-stacked Motherboard Repair – 3 in 1 BGA Reballing Fixture For iPhone X\/XS\/XS Max<\/a><\/p>\n

The 3 in 1 BGA Reballing Fixture can complete your reballing work easily and efficiently.<\/p>\n

With the reballing stencil fitting perfectly with the lower layer, even and full solder balls can be ensured.<\/p>\n

\"3<\/p>\n

Step 4: Motherboard Recombining<\/strong><\/h2>\n

After reballing work. We need to solder the two layers back together.<\/p>\n

Here in this step, we will use the same tool as in the previous motherboard separating process – 3 in 1 Heating Platform For iPhone X\/XS\/XS Max<\/a>.<\/p>\n

\"3<\/p>\n

For more details about the iPhone X\/XS\/XS Max\/ 11 Pro\/Pro Max Motherboard repair, please check the video below.<\/p>\n

You can also visit REWA YouTube Channel for more videos.<\/p>\n