{"id":2158,"date":"2019-11-10T00:00:00","date_gmt":"2019-11-10T00:00:00","guid":{"rendered":"http:\/\/192.168.2.19:8666\/?p=1"},"modified":"2023-10-27T17:10:51","modified_gmt":"2023-10-27T09:10:51","slug":"iphone-11-pro-motherboard-separation","status":"publish","type":"post","link":"https:\/\/rewa.tech\/it\/iphone-11-pro-motherboard-separation\/","title":{"rendered":"iPhone 11 Pro Motherboard Separation"},"content":{"rendered":"

As we all know, iPhone new series have undergone considerable changes on both inside and outside.<\/p>\n

Especially on the motherboard.<\/p>\n

How will these changes affect the repair industry?<\/p>\n

Will it make third-party repair harder or easier?<\/p>\n

Follow our iPhone 11 Pro motherboard separation & recombination blog today and find the answer by yourself.<\/p>\n

iPhone 11 Pro Motherboard Separation<\/strong><\/h2>\n

Compared with iPhone X series, iPhone 11 Pro\u2019s motherboard is smaller with a much denser component array.<\/p>\n

It is also thicker.<\/p>\n

There are layers of graphite thermal transfer material on the backside.<\/p>\n

It can dissipate heat generated from the motherboard efficiently.
\n\"Compared<\/p>\n

Passo 1<\/strong><\/h3>\n

Remove the graphite thermal transfer material with tweezers first.<\/p>\n

To recombine the two layers without reballing after separation, let\u2019s fit two screws into the screw holes reserved on the motherboard.<\/p>\n

\"Remove<\/p>\n

Passo 2<\/strong><\/h3>\n

Set temperature of the heating platform at 170\u2103.<\/p>\n

With temperature of the platform reaching 170\u2103, place the motherboard on the platform to heat for 3 minutes.<\/p>\n

Press the SIM card reader with the tweezers and push the upper layer with another tweezers slightly.
\n\"Set<\/p>\n

Passo 3<\/strong><\/h3>\n

With solder balls on the third space PCB starting to melt, clamp the screws fitted into the screw holes with tweezers and pick up the upper layer with tweezers vertically.<\/p>\n

Tips: do not shake the tweezers when picking up the upper layer.<\/p>\n

The third space PCB might be stuck in bridging issues and the recombination work would also be affected.<\/p>\n

Continue to pick up the lower layer.<\/p>\n

iPhone 11 Pro Motherboard Structure<\/strong><\/p>\n

Now let\u2019s start with the structure of the motherboard.<\/p>\n

The Upper Layer<\/strong><\/p>\n

\"iPhone<\/p>\n

A.Thermal Compound<\/strong><\/p>\n

CPU and areas around CPU are covered with a large amount of thermal compound to dissipate heat generated from A13 CPU.<\/p>\n

B.IC Sealing<\/strong><\/p>\n

CPU, PMU, and inductors around PMU are sealed with adhesive adding to the difficulty of repairs to some extent.<\/p>\n

C.Dense Component Array Around PMU<\/strong><\/p>\n

Professional handwork is required when soldering\/desoldering PMU.<\/p>\n

D.IC USB<\/strong><\/p>\n

Unlike iPhone X series, the USB IC of iPhone 11 Pro hasn\u2019t been sealed with adhesive, and it is far from CPU.<\/p>\n

Therefore, the difficulty of USB IC relevant repairs is relatively reduced<\/p>\n

Unlike iPhone X series, the A13 CPU of iPhone 11 Pro is not located right on the backside of the NAND flash chip.<\/p>\n

This can reduce the bridging possibility of CPU when soldering\/desoldering the NAND flash chip.<\/p>\n

The Lower Layer<\/strong><\/p>\n

\"The<\/p>\n

A.<\/strong> Different from iPhone X series, the lower layer of iPhone 11 Pro has a dispersive\u00a0component array. Therefore, the difficulty of signal relevant repairs is also reduced.<\/p>\n

B.<\/strong> Unlike iPhone X series, the SIM card reader of iPhone 11 Pro is independent from other components. We don\u2019t have to remove the SIM card reader when working on signal relevant repairs.<\/p>\n

iPhone 11 Pro Motherboard Recombination Without Reballing<\/strong><\/p>\n

Set temperature of the heating platform at 170\u2103.<\/p>\n

With temperature of the platform reaching 170\u2103, place the lower layer on the platform to heat for 10 seconds.<\/p>\n

Apply some Paste Flux to the third space PCB evenly.<\/p>\n

Get the upper layer in position and heat for about 5 minutes.
\n\"Set<\/p>\n

Then, press the SIM card reader with the tweezers and push the upper layer with another tweezers slightly.<\/p>\n

If the upper layer\u00a0returns to the previous position automatically, then the soldering process is completed.<\/p>\n

Test <\/strong><\/p>\n

Now we can assemble the phone and test.<\/p>\n

\"Test<\/p>\n

Get the motherboard\u00a0and display assembly installed\u00a0and get the battery\u00a0connected.<\/p>\n

Press the power button to turn on the phone.<\/p>\n

The phone turns on normally.<\/p>\n

Run function test. All going well.<\/p>\n

Sintesi<\/strong><\/p>\n

The\u00a0separation&recombination\u00a0of the motherboard of iPhone 11 Pro shows that the motherboard is smaller and more squared.<\/p>\n

Compared with the iPhone X series, it will not be easily\u00a0damaged by external forces.<\/p>\n

The high integration of the motherboard also means that more professional handwork is required.<\/p>\n

Overall, the difficulty of iPhone 11 Pro motherboard repairs is reduced.<\/p>\n

Strumenti e parti di ricambio<\/strong><\/p>\n

    \n
  • Stazione di rilavorazione con pistola ad aria calda<\/span><\/li>\n
  • Pinzetta dritta<\/a><\/li>\n
  • Cacciavite a croce<\/a><\/li>\n
  • Cacciavite Pentalobo<\/span><\/li>\n
  • Cacciavite a tre ali<\/span><\/li>\n
  • Piattaforma integrata per la riparazione dei telefoni cellulari<\/a><\/li>\n
  • Barra antistatica<\/a><\/li>\n<\/ul>\n

    Potete anche visitare\u00a0<\/span>Canale Youtube REWA<\/a>\u00a0<\/span>to\u00a0check our video of\u00a0iPhone 11 Pro Motherboard Separation And Recombination.<\/p>\n