Recupero dei dati di Samsung S10 dalla scheda incrinata

Today we will take SAMSUNG S10 to show how to recover data by board swap.

First, we can see that the motherboard is seriously deformed with obvious crack.

One thing to mention here is that, compare to iPhone which bound to NAND, CPU, Baseband, EEPROM, Wi-Fi, etc..

For the Samsung S10 Data Recovery, it only needs to move the CPU and flash memory.

Let’s start the operation.

Turn the hot air gun to 420℃, airflow 80 to desolder RAM.

Heating around the RAM. Be careful to move the hot air gun to disperse the temperature, do not point directly to the RAM.

Continue to use the hot air gun at 420℃, airflow 80, use the residual heat to remove the CPU faster.

Next, let’s desolder the flash memory.

Hot air gun temperature is still 420℃, airflow 80. Gently penetrate the blade while heating.

Do not stab in all at once, or turn the inserted blade. Instead, use a gentle push-up to remove it.

After taking off the flash memory chip, we will need to reball it.

Add some flux paste and medium-temperature solder to the bonding pad. Set soldering iron 380℃ to heat and remove the solder and glue on the bonding pad.

Use the solder wick to clean the residual tin on the bonding pads. 

And then clean it with PCB cleaner.

Turn hot air gun to 300℃, airflow 60 to clean up the glue.

Use the same way to clean the back of the CPU bonding pads.

After completing the above steps, we need to clean the flash memory and the RAM.

After cleaning, reball the CPU.

Apply a layer of medium-temperature solder paste to the CPU. Hot air gun 320℃, airflow 60 to form the solder balls.

Continue heating with hot air gun to reset it.

Solder the RAM and flash memory in the same way.

Next, let’s swap the CPU and UFS chip to a functional motherboard.

First thing is to remove the shield, with hot air gun 420℃, airflow 40.

If you are not skilled enough, we recommend using the cutter to cut it off.

Remove the CPU and flash memory.

Then de-gluing and remove the solder of the motherboard bonding pad.

Add some flux paste to the motherboard bonding pads, align the RAM with the motherboard, hot air gun 350℃, airflow 80 to solder.

Solder the CPU and RAM in the same way.

After that cool down the motherboard and clean with PCB cleaner.

Install the motherboard to the phone, the phone turns on normally.

Data recovery perfectly!

If you want to learn mobile phone repair, please feel free to visit Accademia REWA

Domande frequenti

Q:  What repair tools you use for the data recovery process?

A: The tools list as below for your reference

REFOX RS30 ESD Telefono di riparazione Pad di riscaldamento

Reballing Stencils For Samsung (S/Note/A Series)

SUGON T36 SMD Soldering Iron Station

Stazione di rilavorazione con pistola ad aria calda QUICK 861DW

MaAnt Soldering Wick

AMTECH NC-559 Needles BGA Flux Paste

Q:  Do you offer personal repair services?

A: REWA currently does not offer personal repair services, if you want to learn mobile repair please feel free to visit Accademia REWA.