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iPhone 8 Plus Motherboard Repair: How We Fixed Cracked PCB & Wi-Fi Issues After Drop Damage

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When a customer brought in a severely damaged iPhone 8 Plus, many would have deemed it unrepairable. The device had suffered a brutal drop, cracking the screen, shattering the back glass, and—most critically—damaging the motherboard. However, for skilled technicians, even a cracked PCB doesn’t mean it’s game over.

In this article, we’ll guide you through the full iPhone 8 Plus motherboard repair process, step-by-step—from diagnosing Wi-Fi failure to jumping micro traces with UV mask support. Whether you’re a repair technician, DIYer, or refurbisher, this guide will show you what’s possible with board-level repair.

Defect Symptoms After Drop Damage:

  • Cracked screen
  • Shattered back glass
  • No microphone function during calls or voice memos
  • Wi-Fi toggle ON, but no signal detection
01 The screen display and touch function works fine

Troubleshooting Summary:

  • Screen: Touch and display still functional → screen refurbishment chosen to save cost.
  • Back glass: Replaced with a new one (with dock flex/microphone attached).
  • No voice recording or call audio: Caused by dock flex damage; solved with back housing replacement.
  • Wi-Fi issue: Root cause traced to a cracked motherboard—specifically antenna lines on the PCB.
01 The motherboard get cracked already

Repair Process: iPhone 8 Plus Motherboard Fix

1. Disassemble the Phone

  • Remove screen, battery, and internal screws.
  • Take out the motherboard carefully.
03 Stick the cracked part with the motherboard with the UV mask first

2. Inspect the Damage

  • A visible crack was found in the corner of the PCB.
  • Bitmap analysis showed that antenna traces were broken near the damaged zone.

3. Stabilize the Crack

  • Temporarily secured the cracked section with a UV-curable solder mask.

Luckily, the cracked part can be fixed by jumping wire.

Side A

07 remove the black glue on the small components

then jump wire as below

08 jump wire on the side A

4. Side A Repair – Jump Wire Fix

  • Identify broken antenna pads using the bitmap.
  • Use micro jumper wire to bridge the broken traces.
  • Cover with UV mask and cure with a UV lamp.

After jumping the wire apply with the UV mask, then cure it with the UV lamp

09 Apply UV mask and cure with the UV lamp

4. Side A Repair – Jump Wire Fix

  • Identify broken antenna pads using the bitmap.
  • Use micro jumper wire to bridge the broken traces.
  • Cover with UV mask and cure with a UV lamp.

Side B

Refer to the bitmap and fix the other side. Two wires should be jumped, then cure with the UV lamp.

10 Jump a wire and Cure the side B

Apply a little bit more of the UV mask to the cracked part

11 Apply a little bit more UV mask on the cracked motherboard

Cure with the UV lamp again to enhance the bonding

Fix the Cracked Motherboard

Repair Outcome

  • Wi-Fi issue resolved: Signal scan and connection restored.
  • Microphone works again: Voice memos and call audio back to normal.
  • All functions pass post-repair testing.

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REWA Academy

As an enthusiastic educator and expert in mobile technology, REWA Academy has dedicated its career to empowering individuals through technical education. With a keen focus on cellphone repairs, they have developed comprehensive online and offline courses at REWA Academy. Their expertise spans a wide array of areas, including iPhone repair training, phone hardware, software, and advanced troubleshooting techniques. Through their writings, they aim to demystify mobile technology complexities, making it accessible and understandable for both novices and professionals in the field.
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