iPhone Motherboard Separation and Combination Skill Sharing.
Since the iPhone X the iPhone motherboard with a double-layer structure design, which makes the board more integrated and smaller in size, so that there is more space for the battery, camera module, speaker, and new function. However, the double-layer structure design also has some disadvantages, the biggest problem is the poor soldering or connection between the two layers of the motherboard. So knowing and handling the motherboard separation and combination is a very basic skill for iPhone X and above model repair.
In this article, we will share the operation process briefly.
Tools Required
- Motherboard desolder and solder station
- Tweezer
- Sculpture knife
- Hot Air gun/ station
- Soldering iron
- Motherboard function test fixture
- Solder paste
- Middle Frame Reballing Platform
Basic steps
- Separate the two layers of the motherboard
- Clean the pads on the frame
- Check the function with the test fixture
- Reball the frame with the middle frame reballing platform
- Recombine the two layers of the motherboard by the heating station
Let’s see the detailed process of each step
Step 1. Separate the two layers of the motherboard
- Place the motherboard on the heating platform
- Fix the motherboard on the motherboard with the holder
- Set the temperature of the heating platform at 150℃
- With the temperature of the heating platform reaching 150℃, the tins between two layers of the motherboard start to melt. Insert the knife slightly and pick up the upper layer of the motherboard with tweezers slightly
Step 2. Clean the pads on the middle frame
Clean the tins on the lower layer of the motherboard first.
- Set the heating platform temperature to 100℃, and set the soldering station temperature at around 360℃.
- Apply some rosin on the solder wick, and work with the soldering iron station to remove the residual tin on the PCB pads.
Then clean the pads on the first layer of the motherboard
The process is almost the same, we need to fix the motherboard on the PCB holder, then set the soldering station temperature at 360℃, and apply rosin on the solder wick to clean the tin pads on the 3rd party PCB.
Step 3. Check the function of the motherboard with the test fixture
Cool down the motherboard, then place the two layers of the motherboard into the test fixture
A demo of how to place the boards and test needle properly
Then connect the screen, battery connector connects with the DC power supply. Trigger to boot the phone
Ensure the phone can be booted normally, then test the basic function like display, touch, etc.
4. Reball the frame with the middle frame reballing platform
5. The last step, recombine the two layers of the motherboard by the heating station
- Apply some BGA solder paste flux to the middle pads
Heat again the tin balls with the hot air gun ( here we use 990 AD) at 330℃ to ensure the formation of the tin balls
Attache the finished reballing two layers of the motherboard on the heating platform, and adjust slightly with tweezer to get the upper layer in position.
After alignment, turn on the heating platform and set the temperature of the platform at 130℃.
Wait till we can see the upper layer sinking down and paste flux flowing, continue heating 1 more minute, then power off the heating platform.
When the motherboard cools down (cool for at least 5-10 minutes), detach the motherboard from the platform and check the combination effect, ensuring the combination is OK.
Last but not the least, assemble the phone and test it again to ensure all the functions are working fine.
>>> Visit REWA Academy to learn more handwork and repair knowledge.