iPhone series from iPhone X to the newest iPhone 11 Pro Max comes with the double-stacked motherboard.
Therefore, it is important for repair shops to improve double-stacked motherboard repair techniques. REWA highly recommends the following 3 must-have tools for iPhone double-stacked motherboard repair.
Check it now! Double-stacked Motherboard Repair Steps There are 4 steps to repair the double-stacked motherboard as follows:
Step 1: Motherboard Separating
When repairing the logic board of the iPhone series before iPhone X, we can remove/solder components with the help of the Hot Air Gun.
However, with the motherboards of iPhone X and later models being double-stacked, the Hot Air Gun fails to heat the third space PCB evenly due to the large range.
Hereby we recommend this Specialized Heating platform for your double-stacked motherboard repair.
A Must-have Tool For Motherboard Separating During Double-stacked Motherboard Repair – 3 in 1 Heating Platform For iPhone X/XS/XS Max
You will need the Motherboard Disassemble Platform Main Unit For iPhone – SS-T12A and Motherboard Disassemble Platform Heating Groove For iPhone X/XS/XS Max – T12A – X3.
The 3 in 1 Heating Platform For iPhone X/XS/XS Max is suitable for iPhone X/XS/XS Max motherboard separating, CPU and other components removing. The temperature range is 100-280℃.
Tips: Traditional Hot Air Gun features high requirements for temperature control.
Therefore, any carelessness may result in solder joint falling-off or bridging that leads to not turning on of the motherboard or other issues.
Step 2: Diagnosing & Trouble Shooting
During the repairing of the double-stacked motherboard, there is always a time when we need to test the motherboard completely.
And to do that, we need to solder the two layers back together.
Now, with this third space PCB Test Fixture, we can test the motherboard completely without recombining the two layers.
A Must-have Tool For Diagnosing&Troubleshooting During Double-stacked Motherboard Repair – 2 in 1 Test Fixture For iPhone XS/XS Max and Test Fixture For iPhone X With the help of the test fixture, repair technicians can narrow down fault possibilities when troubleshooting the motherboard.
It can not only improve repair efficiency but also bring less damage to the motherboard.
Step 3: Lower Layer Reballing
We need to solder the two layers back together after troubleshooting.
A Must-have Tool For Lower Layer Reballing During Double-stacked Motherboard Repair – 3 in 1 BGA Reballing Fixture For iPhone X/XS/XS Max
The 3 in 1 BGA Reballing Fixture can complete your reballing work easily and efficiently.
With the reballing stencil fitting perfectly with the lower layer, even and full solder balls can be ensured.
Step 4: Motherboard Recombining
After reballing work. We need to solder the two layers back together.
Here in this step, we will use the same tool as in the previous motherboard separating process – 3 in 1 Heating Platform For iPhone X/XS/XS Max.
For more details about the iPhone X/XS/XS Max/ 11 Pro/Pro Max Motherboard repair, please check the video below.
You can also visit REWA YouTube Channel for more videos.
For iPhone X/XS/XS Max/11 Pro/11 Pro Max motherboard repair kit, please stay tuned to REWA Online Shop.
Any questions and demands please feel free to contact us: sales@rewatechnology.com
