How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

One of the most commonly used tools in phone repair is the hot air gun, which requires a high level of technical expertise on the part of technicians. In both the process of soldering and desoldering motherboard components, a hot air gun is required.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Types of Hot Air Guns

Today we will walk you through some basic knowledge of hot air gun in phone repair. Hot air guns come in two main types: helical wind and vertical wind.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Helical Wind Type:

  1. imarily used for soldering and desoldering larger components like connectors, NAND, CPUs, and WiFi modules.
  2. Features gentle airflow and lower heat output.

Vertical Wind Type

  • Ideal for soldering and desoldering small components such as resistors and capacitors.
  • Offers concentrated airflow and higher heat levels.
How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Proper Use of Hot Air Guns

Proper utilization of the hot air gun can improve repair effectiveness, but improper usage may harm the phone. Different scenarios require specific temperature and airflow settings for the hot air gun. If the temperature is too low, component removal becomes impossible and soldering will be flawed. Conversely, high temperatures can cause damage to components and the PCB board.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

What’s more, components will get blown away if the airflow is set too high. Therefore, proper use of the hot air gun is the key to phone repair

Then we will show you how to use hot air gun properly for phone repair. First of all, let’s take a look at how to desolder small components. Vertical wind hot air gun is used to desolder these kinds of components.

The temperature should be set around 330 °C-365 °C and airflow around 1-3. Because the vertical wind hot air gun heats up so quickly, please wait to begin working until the temperature is stable after starting up.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

In addition, the nozzle should be kept vertical from the component with a distance of 3-6 mm. You should heat evenly above the component for about 13-18 seconds. Then remove the component with tweezers.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

For soldering, the soldering method is the same as the desoldering method. You need to put the component in position firstly and pay attention to the temperature as well as airflow.

Next, let’s see how to desolder large chips with hot air gun. Corner adhesive needs to be removed when we use hot air gun to desolder large chips like NAND. Helical wind hot air gun is used to desolder these kinds of large chips. Please apply high-temperature tape around the component to protect surrounding components.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

The temperature should be set around 365 °C-400 °C and airflow around 45-65. The nozzle should be kept vertical from the component with a distance of 6-8 mm.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

You should heat evenly above the component for about 40 seconds. Then pry up the component with a pry blade.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

In summary, the nozzle of hot air gun should be kept vertical from the soldering surface with a suitable distance. Other than that, the temperature and airflow of the hot air gun must be set properly according to the actual repair circumstances.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Please note that the temperature sometimes has to be adjusted according to the type of fixture. The synthetic stone fixture dissipates heat slowly, and the temperature can be lower.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

The iron fixture dissipates heat quickly, and the temperature should be set higher.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Most motherboard repairs will use a hot air gun. Choosing the right one will make your repair easier with high efficiency. Two in one hot air gun has always been a hot-selling product in the phone repair industry. REWA Selected recommends the 2 in 1 SUGON 8620 hot air gun to you.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

The hot air gun heats up quickly with multiple nozzles. You can easily switch between helical and vertical wind directly by changing the nozzle to achieve different application scenarios.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Besides that, its design is also very user-friendly, easy to use, and easy to place.

How to Use a Hot Air Gun – iPhone Motherboard Repair Tips

Choosing the Right Hot Air Gun

Selecting the right hot air gun is essential for efficient repairs. Consider two-in-one hot air guns like the SUGON 8620, which offers quick heating and versatility with multiple nozzles for various applications.

Conclusion

Mastering the use of a hot air gun in phone repair is crucial for successful repairs. Follow these guidelines, use the right tool, and maintain proper temperature and airflow settings to ensure efficient and damage-free phone repairs. For top-quality hot air guns, check out the SUGON 8620 at the REWA shop. Leave your thoughts on hot air gun usage in the comments section below.

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REWA Team

We are the REWA Team, a division of REWA Technology consisting of repair technicians, experts, and marketers. Each article we produce is crafted with great care and input from various individuals.

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