Malfunction Phenomenon
Bluetooth signal can’t be received by phone.
Trouble Shooting
For the iPhone X No Bluetooth Issue. As usual, the first step let’s take apart the phone and run the cosmetic inspection of the motherboard.
The motherboard gets a little bit deformed. According to the experience of repair, the fault is might be related to the part of lines that are disconnected on the motherboard.
Then we detach two layers from each other and found that some of the bonding pads on the middle frame are missed. So the fault should be related to the bonding pad of pin S106 on cylinders around the edge of the lower layer.
Check the bitmap and we treat it with jumper wiring.
After finishing the jumping wire, then we make the upper layer and lower layer solder together, and assemble it and test again, problem resolved.
Again, the issue is caused by the poor connection between the two layers of the motherboard.
So it’s really important to handle the skill of separating and resolder the two layers of the motherboard. Learn the detailed process from REWA Academy iPhone Motherboard Repair Handwork Course.
